Product classification
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F1850It is a high-speed turret-type sorting machine equipped with force control functions. Using our latestNV Core visual inspection system, in conjunction with different types of testing machines for electrical testing and appearance inspection of various types of packages. All tested and inspected devices will be sorted into different output modules as required. This sorting machine is widely used for high-speed and high-precision testing and sorting of semiconductor devices.
C2618It is a high-speed device transfer system. This equipment is customized according to customer needs and is suitable forTrayInput orTrayOutput applications.
ND840YesA high-speed turret sorting machine equipped with high-speed testing and packaging systems, featuring wafer input trays, electrical testing stations, visual inspection, and other functions.
ND1040FIt is a sorting system suitable for wafers and advanced packaging products, configurable with six-sided visual inspection, electrical testing, laser marking, and sorting packaging functions.
T3818It is a multi-station testing and sorting system, and the product can be tested and classified under three temperature conditions: high temperature,/room temperature,/and low temperature. The gravity-type three-temperature testing and sorting machine is suitable for various packaged devices.
T3618 is a turret-type three-temperature testing and sorting integrated machine equipped with a banding system, suitable for testing and sorting products such as automotive electronics that require high reliability.
H1618It is a high-speed turret sorting machine equipped with a high-speed testing and sorting system. It is equipped with multiple stations(24/32/36), multiple testing stations, and various discharge options.H1618It has a high degree of flexibility and can be customized according to different types of inputs and outputs.
F1850MIt is a turret-type sorting machine equipped with high-speed testing, sorting, and packaging systems, specifically designed for mini packaging, focusing on precise force control during the pick and place process.
In an era where the demand for intelligent and new energy devices is growing, iterative processes bring about the need for more cost-effective, stable, and reliable ATE to achieve more efficient large-scale production of complex SoC devices with higher density.
Macrotest's latest generation SoC testing system, the MS8000, features an integrated test head architecture, high-speed system bus, and system-level circuit boards, providing higher resource density and ultra-high parallel testing capabilities. The MS8000 allows for the acquisition of various high-end functions at a lower cost, adapting to new trends in SoC testing.
The MS8000 aims to become one of the most competitive products in the local and global SoC testing market by offering optimized cost-performance solutions.
The XI810 high-speed discrete device testing system consists of four measurement units, achieving high-speed parallel testing and multi-station testing through an asynchronous parallel testing architecture. It features real-time waveform acquisition and display capabilities, as well as ultra-fast testing capabilities. It offers various extended testing options to meet diverse customer testing needs at a lower cost.
The XI810HP is a high-speed discrete device testing system developed based on the XI810 system platform upgrade. It supports dual-station parallel testing. It features real-time waveform acquisition and display capabilities, as well as fast testing capabilities. It offers various extended testing options to meet diverse customer testing needs at a lower cost.
The OS2000E is a programmable open/short testing system that includes eight 256-channel test modules, supporting up to 2048 channels and parallel testing at up to eight sites. Each site can customize pin assignments and test conditions for each pin. Testing programs can be developed and debugged online through the computer's USB interface, allowing for downloading, running, and monitoring. After downloading the USB program, the testing machine can operate independently of the computer. The product features an integrated design, modular structure, and self-elevating structure.
Contact Us
Nanjing Hongtai Semiconductor Technology Co., Ltd. (Group Headquarters)
Phone Number:+86-25-69067857
Floor 15 and 16, Block A, IC Design Building, No. 99 Jinsui Road, Pukou District, Nanjing City, Jiangsu Province
Shanghai Hongtai Core Semiconductor Technology Co., Ltd. (Shanghai Subsidiary)
Phone Number:+86-21-53082067
Address: Floor 6, Building 3, East District, 2169 Chen Hang Highway, Minhang District, Shanghai
Shenzhen Nuotai Core Equipment Co., Ltd. (Shenzhen Subsidiary)
Phone Number:+86-18123860446
Address:461 South Ring Road, Building D, 1st to 3rd Floor, Heyi Community, Shajing Sub-district, Bao'an District, Shenzhen City
Azur Test Co., Ltd. (Nippon Child)
Phone Number:+81-49-211-5033
Site: 2-8-15 Kasumigaseki East, Kawagoe-shi, Saitama Plaza S Kasumigaseki 1F
Nanjing Hengtai Core Technology Co., Ltd. (Nanjing Subsidiary)
Phone Number:+86-25-58915619
Address: Floor 17, Block A, IC Design Building, No. 99 Jinsui Road, Pukou District, Nanjing
Su Gong Wang An Bei No. 32011102010656